Sub-Projects

  • Sub-Project 02

    Sustainable Research and Development

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  • Sub-Project 03

    Single Wafer Critical Cleaning 450 mm

  • Sub-Project 04

    Advanced Batch Processing

  • Sub-Project 05

    Critical Wafer Handling

  • Sub-Project 06

    Vacuum Transportation Interface for 450 mm

  • Sub-Project 07

    450 mm Defects Metrology for Process and Materials Characterization and Qualification

  • Sub-Project 08

    Metrology Components

  • Sub-Project 09

    3D Integrated Measurement System

  • Sub-Project 10

    Direct Covalent Bonding at Room Temperature

  • Sub-Project 11

    Inspection for 3D Integrated Photonics Circuts

  • Sub-Project 12

    X-Ray Metrology

  • Sub-Project 13

    Rapid Electrical Field Driven Processing of Gate Dielectrics on Silicon Carbide

  • Sub-Project 14

    Thermal Laser Seperation for Fast High Quality Silicon Carbide Dicing