INSPECTION FOR 3D INTEGRATED PHOTONICS CIRCUITS
- The subproject aims to evaluate the possibility to adapt standard CMOS defectivity tool for KETs application: 3D Heterogeneous integration and Photonics.
Advances Proposed in SP11
- An assessment on available solutions have been establish amount the majors tool constructor excelling on this domain
- Initial assessment of feasibility and capability as well as identification of the hard points to improve in the tool have been done
- Discussion on chuck specification in order to improve capabilities and ease of use for both cases : standard CMOS defectivity and the targeted KETs applications.