Sub-Projects - SP11

INSPECTION FOR 3D INTEGRATED PHOTONICS CIRCUITS

Short Description

  • The subproject aims to evaluate the possibility to adapt standard CMOS defectivity tool for KETs application: 3D Heterogeneous integration and Photonics.

Advances Proposed in SP11

  • An assessment on available solutions have been establish amount the majors tool constructor excelling on this domain
  • Initial assessment of feasibility and capability as well as identification of the hard points to improve in the tool have been done
  • Discussion on chuck specification in order to improve capabilities and ease of use for both cases : standard CMOS defectivity and the targeted KETs applications.