Sub-Projects - SP10

DIRECT COVALENT BONDING AT ROOM TEMPERATURE

Short Description

  • Assessment of new manufacturing equipment allowing for room temperature covalent wafer bonding
  • Evaluation of the new processes for applications in the area of engineered substrates, CMOS-MEMS and high vacuum MEMS

Advances Proposed in SP10

  • Development of a surface preparation method for enabling room temperature covalent bonding
  • Characterization of the process for various combinations of materials/surface qualities
  • Setup of a manufacturing environment-compatible process flow, enabling high productivity
  • Process optimization for extremely low contamination levels
  • Implementation of the newly-developed equipment and processes into volume manufacturing environment