Sub-Projects - SP09


Short Description

  • Assessment of an Integrated Measurement System for testing 3D dies and die stacks for the engineering and volume-production market. Application-specific test solution, consisting of (1) fine-pitch, low-force probe cards, (2) advanced probe station, and (3) electrical test equipment.

Advances Proposed in SP09

  • Assessment of first Integrated Measurement System for 3D die and die-stack testing
  • Low-force probe card for pre-bond testing of large-array fine-pitch micro bumps
  • Good electrical contact
  • Little probe damage, no impact on stacking yield
  • Probing D2D stacks on tape frame
  • Probing ultra-thin wafers on tape frame