Sub-Projects - SP08

METROLOGY COMPONENTS

Short Description

  • Set up of an open platform that serves as evaluation stand for different metrology components
  • Evaluation of novel metrology components

Advances Proposed in SP08

  • An open 300/450 mm platform will be made available to support metrology companies in testing their sensors
  • Sensor for carrier life-time measurement for silicon wafer characterization at low injection levels (high sensitivity to below 1 x 109 Fe atoms/cm³)
  • Line-based spectroscopic ellipsometer for fast mapping of 450 mm wafers (throughput of up to 60 wafers/hr)
  • Topography sensor for 450 mm wafers (Makyoh-based, field-of-view ≥ 300 mm + stitching)