Sub-Projects - SP05


Short Description

  • Assessment of clean handling technologies for ultra thin 300 mm and 450 mm wafers
  • Evaluation of different end-effector handling concepts: Bernoulli, Ultrasound, Edge-grip and Backside grip

Advances Proposed in SP05

  • Clean and safe handling of ultra thin 300 mm wafers and 450 mm wafers
  • Enabling contact free handling for 450 mm wafers and thinned wafer substrates with smaller wafer diameters
  • Adapting end-effectors on a 450 mm cluster platform
  • Comparison between the four different end-effectors relating to particle generation, contamination, bow, and placing accuracy
  • Testing end-effectors with regard to industrial applicability