Sub-Projects - SP03


Short Description

  • Assess a single wafer cleaning pilot line system
  • In consultation between equipment supplier, pilot line operator and end user, this equipment assessment will focus on test cases related to front end of line wet cleaning and etching processes, relevant to 1x nm technology nodes on a Lam Research’s single wafer spin clean system

Advances Proposed in SP03

  • Spin Clean Systems are being used for high volume production in FEOL, MOL and BEOL for 2x nm technology on 300mm wafers
  • Industry transition to 450mm wafer size is intended to be combined with new technology nodes 1xnm and smaller
  • Currently 10nm and 7nm technology is at an early development stage on 300mm
  • Project start has been postponed due to change of industry timing for introduction of 450mm